METHOD OF MAKING MULTILAYER FLEXIBLE-RIGID INTEGRATED BOARDS Russian patent published in 2013 - IPC H05K3/46 H05K3/36 H05K3/40 

FIELD: radio engineering, communication.

SUBSTANCE: topological pattern of all conducting layers and electrical contacts between them are formed in one process by a photomask through photolithography, wherein an electrical contact is formed from material of conducting layers. In a single process cycle, a second photomask is used to form windows in dielectric layers of the flexible part for electrical and mechanical connection with the rigid part of the board. The rigid part of the board is made using the conventional technique of double-sided boards. The flexible part and the rigid part are joined, for example, by microwelding, brazing or gluing with electroconductive adhesives, through the windows in the dielectric layers. A multilayer flexible-rigid integrated board is formed by successively folding the flexible part in form of an envelope and placing the rigid part of the board inside, after which all layers of the board are tied into a single structure which meets technical requirements for multilayer boards.

EFFECT: fewer process operations and number of photomasks when making flexible and flexible-rigid multilayer boards, high reliability of electrical contacts between layers of the multilayer board, low labour input and production cost.

10 dwg