METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS Russian patent published in 2023 - IPC H05K3/46 

FIELD: radio electronics.

SUBSTANCE: invention is related in particular to production of multilayer printed circuit boards (MPCB) (printed circuit board module) with a high density of elements and improved heat removal from the inner layers of the board to the outer ones. The technical result is achieved by the fact that the method for manufacturing multilayer printed circuit boards includes creation of control files using the InCam software: a file for drilling through holes for metallization in printed circuit board blanks, a file for milling to a depth of a continuous copper layer of a printed circuit board blank, drawing a topology drawing of each layer, obtaining a printed circuit board blank by pressing all layers by vacuum hot pressing, while the inner layers of the blank contain signal layers and continuous copper layers, preparing the surface of the printed circuit board blank for drilling through holes for plating, drilling through holes for plating, while drawing the inner signal layers located between through holes, milling the surface of the printed circuit board blank to a depth of a continuous copper layer with formation of grooves at the locations of heat-removing polygons, performing chemical metallization of through holes with the formation of heat-removing pads with metallized holes and metallized ends, which are heat-removing polygons of a multilayer printed circuit board, drawing a picture of the outer layers.

EFFECT: invention can be used in the manufacture of unique equipment with high reliability.

1 cl, 1 dwg