FIELD: construction.
SUBSTANCE: glass-soldering material is exposed to infrared radiation from at least one infrared radiation source operating at the first voltage for the first predetermined period of time. The operating voltage of at least one infrared radiation source is reduced from the first to the second voltage during the second predetermined period of time so as to reduce the infrared energy acting on the solder glass. Then the operatimg voltage of at least one infrared radiation source is increased from the second to the third voltage during the third predetermined time period, so as to increasethe infrared energy acting on the solder glass. Then forced or spontaneous cooling of glass-soldering material is performed during the fourth predetermined period of time.
EFFECT: reduced time of heating to obtain solder, reduced stress on the glass substrate.
29 cl, 12 dwg, 2 tbl
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