METHOD OF FASTENING PARTS INSIDE VACUUM DEVICES Russian patent published in 2017 - IPC H01J9/40 

FIELD: electrical engineering.

SUBSTANCE: invention relates to semiconductor engineering and can be used in production of semiconductor devices for attachment of parts inside a vacuum housing, for example, for attachment of semiconductor structures of photocathodes on a substrate to input window of device. Method of attaching parts inside vacuum devices comprises depositing, on rear side on side of substrate of a first part, which is a semiconductor structure, along perimeter using solder of indium or its alloys, a pattern in form of separate zones, not forming closed curve, optionally between separate zones of pattern current-voltage characteristic is measured, then zones are connected with indium or its alloys, to increase area of joint, leaving at least one gap for further gas pumping in gap between joined parts, then structure is placed on pre-exposed in corresponding points second part, then parts are coupled, squeezing and heating in vacuum in horizontal position to temperature of 200–250 °C, wherein mandrel is used: centering device and presser.

EFFECT: technical result is reduction of defects which occur during joining, as well as wider range of used materials.

1 cl, 3 dwg