DEVICE FOR MANUFACTURING PHOTOCATHODE PREFORM OF PHOTOELECTRONIC DEVICE BY A THERMOCOMPRESSION CONNECTION OF SEMICONDUCTOR WAFER WITH GLASS PREFORM Russian patent published in 2018 - IPC H01J9/12 

FIELD: instrument making.

SUBSTANCE: invention relates to the field of photoelectronic devices and can be used to connect a semiconductor structure with a glass input window when manufacturing photocathodes of photoelectronic devices. Device for manufacturing a photocathode preform of a photoelectronic device by a thermocompression connection of a semiconductor wafer with a glass preform comprises a base plate with a surface for accommodating a semiconductor wafer, device for preventing lateral displacement of the semiconductor wafer, a mandrel for housing a glass preform therein, having a first surface facing the base plate and a second surface, which is parallel to the surface to accommodate the semiconductor plate and together with the first surface defines the thickness of the mandrel, the mandrel holding means, the punch with a working surface for pressing the glass preform against the semiconductor wafer, a support surface adapted to contact the first mandrel surface when the glass preform is pressed against the semiconductor wafer. Semiconductor wafer contains a temporary substrate and the layers of the heteroepitaxial structure of the compounds of elements of the III–V groups grown on it, one of said layers being configured to form the emitting surface of the photocathode, and when placing the semiconductor plate on the surface of the base plate, said layers are arranged on top. Glass blank is made with a mounting surface intended for mounting the photocathode to a predetermined position in the photoelectric device and has parallel input and output surfaces and a side surface, when the glass preform is placed in a mandrel, its entrance surface faces the working surface of the punch, and the output surface faces the semiconductor wafer. Mandrel has a third surface for aligning it with the plane of the mounting surface when the glass preform is pressed against the semiconductor wafer. Device is configured to heat the glass preform to the temperature of its plastic deformation and with the possibility of contacting the working surface of the punch with the second surface of the mandrel when the glass preform is pressed against the semiconductor wafer and a predetermined deformation of the glass preform is achieved.

EFFECT: technical solution excludes the effect of the pressing force on the glass preform and the misalignment of the working surface of the punch when the glass blank reaches a predetermined deformation, excludes the operations of controlling and regulating the value of the pressing force applied to the glass preform.

14 cl, 2 dwg