FIELD: metallurgy.
SUBSTANCE: method of manufacturing resistive material from ordering Cu-Pd alloy includes plastic deformation and subsequent annealing, at that, the alloy containing from 48 to 55 at. of palladium is subjected for treatment, plastic deformation is carried out at 80-95%, before which preliminary annealing is carried out, the preliminary and subsequent annealing is carried out at temperature below critical temperature of alloy ordering in the range from 250÷450°C.
EFFECT: expanded range of values of specific electrical resistivity of resistive material with preservation of increased strength characteristics and reduced terms of its manufacturing due to formation of germs of ordered phase in Cu-Pd alloys.
2 cl, 1 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| METHOD OF MANUFACTURE OF MATERIAL FOR WEAK- CURRENT CONTACTS MADE FROM PALLADIUM-BASED ORDERED ALLOY | 2002 |
|
RU2217524C1 |
| METHOD FOR MANUFACTURING ELECTRICAL CONTACTS FROM GOLD-BASED ALLOYS | 2022 |
|
RU2781061C1 |
| METHOD FOR PRODUCTION OF MATERIAL FOR WEAK-CURRENT CONTACTS OF REGULATING ALLOYS ON THE BASE OF PALLADIUM | 1995 |
|
RU2083717C1 |
| METHOD OF THERMAL TREATMENT OF CONTACT PAIR FROM GOLD-COPPER ALLOY ZlM-80 FOR ELECTRIC LOW-CURRENT SLIDING CONTACTS | 2019 |
|
RU2716366C1 |
| METHOD FOR TREATING PALLADIUM-SILVER-COPPER ALLOYS | 0 |
|
SU939588A1 |
| PRODUCTION OF THIN FOIL OF Pd-Cu SOLID SOLUTION WITH CsCi-TYPE LATTICE | 2013 |
|
RU2535843C1 |
| MATERIAL FOR METAL-FILM RESISTIVE LAYER AND METHOD FOR PRODUCING A RESISTIVE LAYER ON BASIS OF SAID MATERIAL | 2001 |
|
RU2280905C2 |
| MANUFACTURING METHOD OF THIN BAND FROM MAGNETICALLY SOFT ALLOY AND BAND OBTAINED BY THIS METHOD | 2012 |
|
RU2630737C2 |
| 0 |
|
SU521352A1 | |
| PROCEDURE FOR MANUFACTURE OF FOIL FOR FLEXIBLE PRINTED CIRCUIT BOARDS OF TWO-PHASE MICRO-COMPOSITE MATERIALS ON BASE OF COPPER | 2010 |
|
RU2432414C1 |
