FIELD: chemistry.
SUBSTANCE: heat-conductive sealant consists of two components: polimer-containing base (component A) and a curing mixture (component B) combined in the mass ratio: for 100 pts wt of component A from 4 pts wt to 12 pts wt of component B, wherein component A is a mixture of a low molecular weight silicone rubber with a molecular weight of 20000-50000 c.u. and silicone oligomer with aluminium oxide (corundum) and silicon carbide with the following ratio of the ingredients, pts wt: low-molecular silicone rubber selected from SKTN of grade A or SKTN 100 of grade B, silicone oligomer selected from PMS-50 or PMC-100 20-40 aluminium oxide (electrocorundum) 120-200, silicon carbide 100-200, and component B is a mixture of ethyl silicate and tin-organic salts selected from tin octoate and tin diethyl-dicaprylate, which may optionally include a silicone oligomer in the following ratio of components, pts wt: ethyl silicate selected from ES-32 and ES-40 100 catalyst - tin-organic salt selected from tin octoate or tin diethyl-dicaprylate of 10-25, ansilicone oligomer selected from PMS-50 to 50.
EFFECT: achievement of certain technological characteristics, such as low viscosity, casting properties, high viability, and increased thermal conductivity.
6 tbl, 12 ex
Title | Year | Author | Number |
---|---|---|---|
THERMAL CONDUCTING COMPONENT FOR SEALING | 2017 |
|
RU2651178C1 |
HEAT-CONDUCTING COMPOUND | 2018 |
|
RU2720195C2 |
COMPOSITE HEAT-CONDUCTING MATERIAL | 2018 |
|
RU2720194C2 |
COMPOSITE MATERIAL | 2015 |
|
RU2610074C2 |
COMPOSITE POLYMER MATERIAL FOR SEALING RADIO-ELECTRONIC PRODUCTS | 2020 |
|
RU2748798C1 |
COMPOSITE POLYMER MATERIAL FOR SEALING | 2020 |
|
RU2745193C1 |
COMPOSITION OF HEAT-CONDUCTING SEALING MATERIAL | 2020 |
|
RU2761621C1 |
FILLED POLYMER COMPOSITE MATERIAL | 2017 |
|
RU2686910C2 |
SILOXANE MATERIAL AND METHOD FOR PRODUCTION THEREOF | 2011 |
|
RU2503695C2 |
HARDENING MIXTURE | 2011 |
|
RU2487149C2 |
Authors
Dates
2018-02-21—Published
2017-01-09—Filed