THERMAL CONDUCTING COMPONENT FOR SEALING Russian patent published in 2018 - IPC C09K3/10 

FIELD: chemistry.

SUBSTANCE: invention relates to the field of polymeric compounds for sealing technical products and systems requiring efficient removal of excess heat energy. Thermal conductive compound for sealing consists of two components: a polymer-containing base-component A and the curing mixture-component B, which are combined in mass ratios: by 100 wt. component A 5–10 wt. h of component B, component A is a mixture of low molecular weight silicone rubber with a molecular weight of 20,000–60,000 c.u. and a silicone oligomer with silicon carbide and silica in the form of quartz powdered. Component B is a mixture of ethyl silicate and an organotin salt selected from tin octoate and diethyldicaprylate of tin. Component B may further comprise a silicone oligomer.

EFFECT: invention makes possible combining the required level of technological characteristics: a relatively low initial viscosity, satisfactory casting properties, high viability with a significant level of thermal conductivity, dielectric and physico-mechanical properties.

1 cl, 6 tbl, 15 ex