HEAT-CONDUCTIVE DIELECTRIC COMPOSITION Russian patent published in 2018 - IPC H01L23/36 

FIELD: technological processes.

SUBSTANCE: invention relates to the field of heat-conducting dielectric compositions and can be used in instrument-making for sealing elements of electronic equipment, for example transistors, diodes, capacitors. Thermally conductive dielectric composition contains epoxy resin ED-20 (GOST 10587-84) and synthetic diamond powder AC6100/80 (GOST 9206-80). To increase the thermal conductivity, electrical strength and vibration resistance, a hardener for epoxy resins L-18 (TU 6-06-1123-98), which is a polyamine adduct with vegetable oil acids, is introduced into the heat-conducting dielectric composition according to the invention, with a certain ratio of components.

EFFECT: invention can be used in instrument-making for sealing elements of electronic equipment, for example transistors, diodes, capacitors.

1 cl, 2 tbl