PEEL PLY, METHOD OF SURFACE PREPARATION AND BONDING COMPOSITE STRUCTURES USING SAME Russian patent published in 2018 - IPC B29C70/54 C08J5/24 C08L63/00 C08K7/26 C09D5/20 

FIELD: technological processes.

SUBSTANCE: invention relates to removable layers for preparing the surface of composite substrates. A resin-encrusted removable layer for preparing surfaces of various composite substrates, comprising a woven fabric, impregnated with a curable matrix based on a resin obtained from a resin composition comprising a mixture of an epoxy phenol novolac resin and a novolak epoxy resin, containing a dicyclopentadiene backbone; a difunctional epoxy resin selected from diglycidyl ethers of polyhydric phenols; trifunctional epoxy resin, selected from triglycidyl ethers of aminophenols; a curing agent and inorganic filler particles, the resin content in the layer being removed being at least 20 % by weight based on the total weight of the layer to be removed and said woven fabric comprising a plurality of threads, woven into the weave, said threads having a tensile strength of the backing ≥ 70 pound-force/inch (1.23×10⁴ N/m), tensile strength of weft threads ≥ 40 pound-force/inch (7.00×10³ N/m), the linear mass density of warp yarns in the range of 50–250 denier and the linear mass density of weft threads in the range of 50–250 denier.

EFFECT: proposed removable layer can be cured together with most commercially available prepregs.

12 cl, 8 dwg, 2 tbl