METHOD FOR MEASURING THERMAL IMPEDANCE OF DIGITAL INTEGRATED CIRCUITS Russian patent published in 2018 - IPC G01R31/28 

FIELD: measuring equipment.

SUBSTANCE: invention relates to equipment for measuring parameters of integrated microcircuits and can be used to control the quality of digital integrated circuits and to determine their temperature reserves. Method for measuring thermal impedance of digital integrated circuits comprises connecting the controlled digital integrated circuit to a power supply with a voltage U_sup, connecting an odd number of logic elements of the digital integrated circuit according to a ring oscillator circuit, which is periodically included in the generation mode by control pulses with a repetition period T_rep, duration τ_Y which are changed according to the harmonic law with the modulation frequency Ω_M, modulation depth m and average duration value τ_Y0: τ_Y=τ_Y0(1+m sinΩ_Mt), (1), at the modulation frequency, the amplitude is extracted and measured by variable component of the current consumed by the digital integrated circuit, amplitude of changes in the oscillator generation frequency and phase difference Δϕ(Ω_M) between these harmonics and the thermal impedance module of the digital integrated circuit at the frequency Ω_M are determined by the formula (3), where K_F – the known negative temperature coefficient of the oscillator generation frequency, and the phase ϕ_T(Ω_M) of thermal impedance is calculated by the formula: ϕT(Ω_M)= Δϕ(Ω_M)-180°.

EFFECT: technical result is reduces error and simplified measurement process.

1 cl, 3 dwg