FIELD: chemistry.
SUBSTANCE: invention relates to the field of experimental electrochemistry for studying the adhesive strength of an electroplating with an oxide material. Invention is aimed at measuring the adhesion of electroplating with oxide materials. Method includes fixing the oxide with a current lead in a substrate of a non-conductive material, applying an electroplating to the oxide surface and soldering a detachable element to it. Device includes fixing the substrate with the detachable element soldered to the coating in the housing.
EFFECT: technical result is the creation of a method and construction of the device that makes it possible to test the adhesive strength of the electroplating applied to the oxide material.
4 cl, 1 dwg
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