FIELD: chemistry.
SUBSTANCE: invention relates to polymer compositions, which are used in electrical engineering for manufacturing high-voltage insulation, in particular hull input and output isolators of electron beam guns operating under the influence of radiation in a vacuum with the current switching up to 30 A, voltage up to 85 kV, H class of heat resistance. Epoxy-diphenolic compound includes (parts by mass): epoxy-dian resin 100, triethanolamine titanate 5–10, oligomer hydroquinone 2–10, pulverized ground quartz 100–110. Hydroquinone oligomer with the degree of polycondensation of n=0–2 with the number average molecular weight of 350 Da, which is obtained from hydroquinone at 240–250 °C in the presence of contact sulfuric acid with the extraction of 9–11 % by weight, is used.
EFFECT: epoxide-diphenolic radiation-resistant compound for manufacturing the electron-beam gun insulators is proposed.
1 cl, 3 tbl
| Title | Year | Author | Number | 
|---|---|---|---|
| POURING COMPOUND | 1992 | 
 | RU2039785C1 | 
| PROCESS FOR PREPARING MOISTURE-PROTECTIVE SEALING COMPOUND | 1993 | 
 | RU2063412C1 | 
| ELECTRIC INSULATING FILLING COMPOUND | 2015 | 
 | RU2598861C1 | 
| EPOXY POURING COMPOUND | 1992 | 
 | RU2036948C1 | 
| ELECTRICAL EMBEDMENT COMPOUND | 2008 | 
 | RU2356116C1 | 
| ELECTRICALLY INSULATING FILLING COMPOSITION | 0 | 
 | SU1134583A1 | 
| METHOD FOR CLEANING EQUIPMENT FROM RESIDUES OF EPOXY COMPOSITIONS | 0 | 
 | SU1065453A1 | 
| INSULATION COMPOUND | 0 | 
 | SU801108A1 | 
| MOISTURE-PROTECTIVE FILLING COMPOUND | 2013 | 
 | RU2552742C2 | 
| ELECTROINSULATING COMPOUND | 0 | 
 | SU964738A1 | 
Authors
Dates
2018-07-04—Published
2017-09-25—Filed