FIELD: technological processes.
SUBSTANCE: method is intended for use in welding production when sealing microelectronic devices (MED) by electron-beam welding with the provision of a controlled atmosphere in their internal volume. Base 1 is made with chamfer 3. Welded edges of base 1 and cover 2 are mechanically modified to the required roughness and degreased with a chemical solvent. In the welding assembly for welding, fix base 1, cover 2 and wedge 6 between them. Device is mounted in a vacuum chamber from which air is pumped out and wedge 6 is extracted with the help of engine 7 and rope 8. Base 1 and cover 2 are closed, moving along chamfer 3. Electron beam welding of the edges of base 1 and lid 2, excluding the thermal and light effects on the internal active elements inside MED. Sealed weld seam is provided, which ensures the tightness requirements of the MED.
EFFECT: technical result consists in reducing the number of operations, reducing production costs, excluding the electron beam from entering the MED, improving the evacuation of air from the internal volume of the MED.
3 cl, 3 dwg
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Authors
Dates
2018-07-09—Published
2017-04-28—Filed