METHOD FOR SEALING MICROCASES Russian patent published in 2019 - IPC H01H49/00 H01L23/04 

FIELD: electrical engineering.

SUBSTANCE: invention relates to microelectronics, in particular, to the technology of final assembly of hermetic microcases with vacuum gas environment inside the case, and can be used in radio electronic equipment (EE) devices with sealed enclosures. Method includes installing the assembled microunit with an exhaust hole in the housing in a vacuum chamber, evacuating air to a predetermined value, filling the internal volume with a gaseous medium and sealing it with a laser beam. Protrusion with an annular groove around it is made in the wall of the microcase housing, an evacuation hole is located in the center of the protrusion, and in the wall of the protrusion an impingement of no more than 20÷30 % of the height of the protrusion and a width of not more than 1/2 of the internal diameter of the protrusion. Laser beam is deposited on the upper part of the protrusion on the lower part of the numbing with the pumping hole, and then finally welded and form an airtight weld. Discharge hole can be made in the form of a groove of an oval shape and is located between two protrusions, and the laser beam ejects the top part of each projection onto the discharge hole.

EFFECT: technical result consists in increasing the reliability and quality of the hermetic weld and excluding the possibility of molten metal or laser beam entering the internal volume of the microassembly.

1 cl, 2 dwg