FIELD: instrument engineering.
SUBSTANCE: invention relates to the field of instrument engineering and can be used for the micromechanical elements manufacturing, used, in particular, for the micromechanical measuring devices sensitive masses suspension, for example, silicon gyroscopes and accelerometers, microneedles, etc. In the micromechanical elements from monocrystalline silicon wafers by the orientation (100) manufacturing method, first anisotropically etching the plate to the depth of the micromechanical elements required thickness obtaining, simultaneously with the above operations for the micromechanical elements formation, forming the control elements test structure located in the micromechanical elements zone, formation is carried out to the determined by mathematical expressions predetermined depth, at that, forming the test structure scales.
EFFECT: invention provides reduction in the manufacture labor intensity and an improvement in the micromechanical elements quality and reproduction accuracy.
1 cl, 4 dwg
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Authors
Dates
2018-07-26—Published
2017-09-01—Filed