FIELD: microelectronics and instrumentation engineering; assembling sealed devices closed with metal cover or shell.
SUBSTANCE: proposed method is includes making hole in case cover of microassembly, its shape enabling fixation of ball and preventing ingress of molten metal and laser beam in microassembly interior. Assembled item is placed in vacuum chamber, air is evacuated from chamber to desired amount, metal ball is installed in hole while still evacuating air from chamber, hole is sealed by laser beam through window in vacuum chamber; in the process laser beam is directed to ball-to-cover joint thereby forming circular weld.
EFFECT: enhanced quality of microassembly sealing.
1 cl, 2 dwg
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