FIELD: heat exchange.
SUBSTANCE: invention relates to means of cooling and can be used in high-heat electronic devices, in particular, for cooling of semiconductor heat-releasing components. Technical result is achieved due to cooling system of semiconductor fuel elements, which comprises a heat-removing element and a heat-removing platform, besides, the platform contains at least one hole, in which at least two threaded inserts from heat-conducting material are installed, wherein lower insert is installed with provision of tight contact with fuel element, and next insert is installed with provision of tight contact with lower insert.
EFFECT: technical result consists in improvement of efficiency of heat removal due to intensification of heat exchange at application of several heat-removing elements in the form of inserts.
14 cl, 3 dwg
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