FIELD: chemistry.
SUBSTANCE: invention discloses a thin-film transistor, comprising a base substrate, an active layer on a base substrate, comprising a first semiconductor region, a second semiconductor region and a plurality of semiconductor bridges, each of which connects a first semiconductor region and a second semiconductor region, wherein said plurality of semiconductor bridges are spaced from each other, wherein said active layer is made of material containing M1OaNb, wherein M1 is one metal or combination of metals, a > 0 and b ≥ 0, etching stop layer on side of active layer, far from base substrate, wherein the first semiconductor region comprises a first non-overlapping portion, a projection of which is outside the projection of the etching stop layer on the top view of the base substrate, and the second semiconductor region comprises a second non-overlapping portion, a projection of which is outside the projection of the etching stop layer on the top view of the base substrate, the first electrode on the side of the first non-overlapping section, far to the base substrate, and the second electrode on the side of the second non-overlapping section, far to the base substrate.
EFFECT: invention provides high density of carriers and high mobility.
18 cl, 8 dwg
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Authors
Dates
2019-11-11—Published
2016-07-08—Filed