FIELD: chemistry.
SUBSTANCE: invention relates to production of glass-ceramic composite material. Disclosed glass-ceramic material contains low-temperature crystallisable glass and aluminium oxide ceramics at ratio of (1.4–1.0):(0.6–1.0), respectively. Low-temperature crystallising glass additionally contains chromium oxide at the following ratio of components, wt. %: SiO2 20–34, BaO 34–40, B2O3 23–26, CaO 1–10, SnO2 1–10, as well as over 100% chromium oxide (Cr2O3) 2–5 and aluminium oxide (Al2O3) 5–10. Prior to composition of the mixture, aluminium oxide and chromium oxide are pre-mixed and calcined at 1300–1400 °C. Low-temperature glass-ceramic material after mixing with organic binder and moulding in the form of articles with current-conducting elements (cermet body, metal-ceramic plate) are combined to anneal organic ligament at temperature 700–800 °C, additionally addition of phosphorus oxide (P2O5) by impregnating in an aqueous solution of orthophosphoric acid (H3RO4), air-dried and cured without flame shrinkage at 300–900 °C for 0.5–2 hours. At the same time there is stabilization of thermomechanical and dielectric properties of material and active crystallisation of matrix glass to produce non-shrinking ceramics.
EFFECT: invention can be used in electrical engineering and radio engineering, in production of housings and substrates for integrated circuits and multilayer ceramic boards of multi-crystal ceramic modules.
3 cl, 2 tbl
Title | Year | Author | Number |
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MIXTURE FOR PRODUCING GLASS-CERAMIC COMPOSITE MATERIAL | 2018 |
|
RU2722012C2 |
LOW-TEMPERATURE GLASS-CERAMIC MATERIAL | 2009 |
|
RU2410358C1 |
CERAMIC RESISTOR UNIT AND ITS MANUFACTURING PROCESS | 2001 |
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LOW TEMPERATURE GLASS CERAMIC MATERIAL FOR ELECTRONIC TECHNOLOGY | 2020 |
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CERAMIC MATERIAL WITH LOW BURNING TEMPERATURE | 2013 |
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RU2527965C1 |
RADIO-TRANSPARENT PROTECTIVE COATING OF ARTICLES FROM CERAMICS, GLASS-CERAMIC, GLASS CERAMIC AND METHOD FOR PRODUCTION THEREOF | 2015 |
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RU2604541C1 |
CHARGE FOR CERAMIC MATERIAL PRODUCTION | 2007 |
|
RU2353600C2 |
SUSPENSION FOR 3D PRINTING OF MULTILAYER PRINTED CIRCUIT BOARDS USING LTCC- AND HTCC-COMPOSITIONS ACCORDING TO DLP TECHNOLOGY | 2023 |
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RU2821459C1 |
ELECTROCONDUCTIVE PASTE | 1990 |
|
RU2024081C1 |
Authors
Dates
2020-01-31—Published
2018-10-03—Filed