FIELD: printing equipment.
SUBSTANCE: invention relates to production of materials for 3D printing, specifically to polymer-ceramic inks for production of multilayer printed circuit boards. Ink based on a polymer-ceramic composition for 3D printing of multilayer printed circuit boards using DIW technology contains ceramic filler and polymer binder. Polymer binder contains polyethylene glycol or polyvinyl acetate and a diluent. Ceramic filler comprises low-temperature (LTCC) or high-temperature (HTCC) co-fired ceramic and dispersing agent.
EFFECT: invention increases insulating resistance, dielectric strength, reliability and capacity to withstand loads in the microwave range with low dielectric loss of articles made from the disclosed polymer-ceramic ink.
1 cl, 4 ex
| Title | Year | Author | Number |
|---|---|---|---|
| TECHNOLOGY OF 3D PRINTING OF MULTILAYER PRINTED CIRCUIT BOARDS USING LTCC- AND HTCC-COMPOSITIONS | 2023 |
|
RU2833244C1 |
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|
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| METHOD OF MANUFACTURE OF TRANSITORY JOINTS IN CERAMIC PRINTED CIRCUIT BOARDS | 0 |
|
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| POLYMER-CEMENT DRY CONSTRUCTION MIXTURE FOR 3D PRINTING | 2020 |
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RU2722012C2 |
