FIELD: performing operations.
SUBSTANCE: invention relates to additive technologies, specifically to a method of producing multilayer printed circuit boards based on co-firing ceramics using 3D printing methods. Technology includes steps of synthesis of raw materials in accordance with the requirements of the additive manufacturing method, moulding article by 3D printing, as well as annealing in order to obtain a functional component.
EFFECT: invention enables to obtain multilayer printed circuit boards made from low-temperature (LTCC) or high-temperature (HTCC) co-firing ceramics by means of 3D printing, which makes it possible to realize more efficient and cheap production of ceramic boards with preservation of ceramic properties, such as high insulation resistance, dielectric strength, high reliability, ability to withstand loads in microwave range with low dielectric losses.
12 cl, 6 ex
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