POLYMER COMPOSITION FOR ADHESIVES Russian patent published in 2020 - IPC C09J123/08 C09J5/02 C09J5/04 C09J11/00 

FIELD: chemistry.

SUBSTANCE: invention relates to an ethylene polymer composition for adhesive compositions, an article which includes an ethylene polymer composition and a method of producing said article. Ethylene polymer composition containing from 10 to 80 wt. % of a polymer mixture of (a) an ethylene copolymer, which is selected from (a1) an ethylene copolymer with a silane group or comonomer group, or (a2) a copolymer of ethylene with one or more polar comonomers, selected from the following comonomers: (C₁-C₆)-alkylacrylate or (C₁-C₆)-alkyl(C₁-C₆)-alkylacrylate, wherein copolymer (a2) contains silane group or groups containing links, and copolymer (a2) differs from copolymer (a1), and (b) ethylene polymer, which differs from copolymer (a1) and copolymer (a2). Polymer mixture contains, based on the total amount, 100 wt. % of copolymer (a) and polymer (b) of at least 55 wt. % of ethylene copolymer (a) and 45 wt. % or less of ethylene polymer (b). Polymer composition further contains (c) from 0.01 to 5.0 wt. % of additive or additives, (d) from 5 to 70 wt. % resin enhancing agent, (g) 0.00001 to 0.1 mole (kg of ethylene polymer (a)) of the cross-linking agent and one or more, or all components (d) - (e), in any combination, where (d) from 0 to 50 wt. % of plasticiser and/or (e) from 0 to 50 wt. % of an additional component or components other than components (d), (e) and (g), where components (d) - (g) differ from components (a) - (c).

EFFECT: technical result is providing glue compositions with higher secant modulus of elasticity in a wide range of operating temperatures, higher strength, value of elastic recovery at high temperatures.

15 cl, 2 dwg, 18 tbl, 20 ex