FIELD: microelectronics.
SUBSTANCE: flexible microelectronic device consists of: a polymer substrate and a self-assembling layer containing an oligomer based on alkoxysilane, chemically bonded to the polymer substrate. Self-assembled layer has a specific size of 10 nm to 20 mcm, and the substrate has a characteristic size of 1 to 1000 mcm. Invention also discloses use of the device in a microelectronic device, a method of producing, use of a method for modifying a substrate, use of the method in the process of making microelectronic devices.
EFFECT: invention improves printing ability and adhesion of conductive ink due to a self-assembling layer which contains an alkoxysilane-based oligomer.
16 cl, 4 dwg
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