METHOD FOR MULTI-CRYSTAL MODULES THERMO-SOUND MICRO-WELDING Russian patent published in 2020 - IPC B23K9/09 H01L21/02 H05K1/18 H05K3/10 

FIELD: physics.

SUBSTANCE: invention can be used for connection of thermic-sound micro-welding of multichip semiconductor microcircuits modules with high assembly density. Welding is performed by capillary electrode with wire melted by supply of reverse polarity current pulses. Ball is formed at the first connection point. Wire is cut off and the ball is formed at the second connection point, and then the jumper is pulled to the first connection point. Ball of the first connection point is flattened to form a wedge and the wire is torn off. Capillary electrode with a conical tip is used, the end diameter of which and cone angle are selected from the condition of receiving the height of the jumper, which excludes contact of the adjacent jumper by the electrode. Surface of contact platform is prepared by purification with alcohol and subsequent purification in plasma for 700–800 s in medium containing 20 % Ar and 80 % O₂.

EFFECT: technical result is high density of installation and high strength of connection.

1 cl, 3 dwg, 1 tbl