FIELD: rocket and space instrumentation.
SUBSTANCE: claimed invention relates to a method for assembling typical stack hybrid modules, where the emphasis is on the simultaneous assembly of surface-mounted components and stack assemblies from crystals without mutual displacement, namely, precision mounting of chip components and compactly mounted in crystal stacks integrated circuits (IC), with the installation of a crystal on a crystal through a silicon gasket and a membrane adhesive.
EFFECT: increased assembly density, due to the choice of the optimal placement of crystals without mutual displacement and chip components relatively to each other and the selection of a metal-ceramic case, improving the accuracy and quality of installation of multi-crystal assemblies and micro-welding.
1 cl, 4 dwg
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