SOLDERED JOINTS ULTRASONIC TESTING METHOD Russian patent published in 2020 - IPC G01N29/04 

FIELD: defectoscopy.

SUBSTANCE: invention can be used for detection of defects in lap-top two-sided solder joints after fabrication and during operation. Essence of the invention consists in the fact that using an ultrasonic flaw detector generating ultrasonic pulses, irradiating the control object with the radiating transducer with these pulses, focusing ultrasound radiation on the middle of the soldered connection, moving the emitting converter along the soldered joint with a constant pitch, determining the position of the receiving transducer by the maximum pulse amplitude, fixing the maximum value of the pulse amplitude, recording the total number of displacements of the N emitting transducer and the number of displacements n, in which the maximum amplitude of the pulse is reduced by two or more times, determining the non-soldered connection sections relative length μ and if it exceeds the permissible value, which is set in accordance with specifications for the product, the connection is rejected.

EFFECT: possibility of simplifying and improving control quality of thin-walled (with thickness of not more than 10 mm) lap soldered connections, which are commercially available by PEP.

1 cl, 1 tbl, 1 dwg