METHOD OF SEPARATING MULTIPLEX SUBSTRATE SEALED WITH EPOXY COMPOUND INTO SEPARATE MICROCIRCUITS Russian patent published in 2021 - IPC H05K13/04 H01L21/64 H01L21/78 

FIELD: physics.

SUBSTANCE: invention relates to methods for separation of multiplex substrates (MS) into separate microcircuits and can be used in manufacturing assemblies of microelectronic equipment. Method of separating MS with an epoxy compound containing a plurality of chips sealed with an epoxide compound involves fixation of the MS in a vacuum holder and its separation into separate microcircuits with a saw with a diamond disk working element. Prior to MS separation it is laminated on the side of compound layer with film material with bearing and glue layers. Bearing layer is selected with thickness of not less than 120 mcm, and adhesive layer - with thickness in range from 10 to 40 mcm and peel strength of not less than 20,000 mN/25 mm. MS separation is performed so that film material retains its integrity. Cutting speed is set in range from 44 to 82 m/s, and speed of feed in range from 20 to 40 mm/s. At that, diamond disk working element is abrasively treated.

EFFECT: technical result is reduction of labour intensity of MS separation process due to exclusion of necessity to manufacture accessories for fixation of MS during production of small batch of microelectronic products or prototypes.

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