FIELD: electronic equipment.
SUBSTANCE: invention relates to electronic engineering, and specifically to methods of separating a plate containing a plurality of crystals into separate microcircuits in small-series and pilot production. Method of separating a plate comprising a plurality of crystals, sealed with a layer of compound, into separate microcircuits, includes fixing the plate in the vacuum holder and separating it into separate microcircuits, wherein before lamination of the plate into separate microcircuits, lamination is performed on the side of compound layer, and separation of plate into separate microcircuits is performed so that lamination material retains its integrity.
EFFECT: invention makes it possible to reduce labour intensity of the process of plate separation at frequent change of its configuration and in the whole process of production of multi-crystal assemblies.
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Authors
Dates
2020-07-02—Published
2019-08-20—Filed