METHOD FOR MANUFACTURING A MICROMODULE Russian patent published in 2022 - IPC H01L25/04 

FIELD: electronics.

SUBSTANCE: invention relates to the technology of microelectronic apparatus consisting of multiple solid-state semiconductor components, and can be used in the manufacture of equipment with high-density wiring. Method for manufacturing a micromodule includes the stages of forming switching layers, through metallised holes on the switching board, installing an unpackaged chip, creating electrical connections between the unpackaged chip and the board by microwelding, forming a package of switching boards by creating electrical connections between the switching boards applying conductive microspheres, filling the space formed between the switching boards with compound, and packaging. According to the invention, the unpackaged chip is mounted into a pre-profiled switching board after creating switching layers on the side not occupied by switching layers, by consecutively forming a blind hole for mounting the unpackaged chip and a through hole inside the blind one by "dry" etching consecutively in a Bosch process for switching the board with the unpackaged chip through a photoresist mask pre-formed by spraying.

EFFECT: invention allows for manufacture of a micromodule with reduced weight and size characteristics and a high degree of integration.

6 cl, 3 dwg