METHOD FOR ASSEMBLING RIGID PROBE HEADS Russian patent published in 2021 - IPC H01L31/00 

FIELD: microelectronics.

SUBSTANCE: invention relates to the field of semiconductor microelectronics, namely to the technology of manufacturing rigid probe heads intended for electrical connection of contact pads of LSI chips with external control circuits and for measuring LSI parameters. The technical result is achieved by the fact that the configuration of the inner boundary of the reinforcing ring is determined specifically for each chip by calculating the lengths of probe reach to each contact pad. The shape of the inner boundary of the reinforcing ring is defined by a polygonal curve connecting points on each probe located equidistantly from the point of contact of the contact pad, and the inner radius of the forming ring is equal to the greatest distance from the centre of the reinforcing ring. The outer boundary of the reinforcing ring matches the outer boundary of the forming ring corresponding with the given chip size. After drawing the polygonal line, the corners thereof are smoothed to result in a curved border of the ring, convenient for manufacture. The finished drawing of the boundaries of the reinforcing ring is then transferred to a template whereby the reinforcing ring is manufactured from a workpiece by cutting with a fretsaw or laser or forming on a 3D printer.

EFFECT: purpose of the invention is development of a method for assembling RPHs intended for controlling chips with any location of contact pads, including over the entire surface of the chip, maintaining the same lengths of probe reach over the entire RPH.

1 cl, 5 dwg