METHOD OF ASSEMBLING PHOTOSENSITIVE MODULE ON RASTER Russian patent published in 2016 - IPC H01L31/18 

FIELD: physics.

SUBSTANCE: invention relates to design of matrix semiconductor photodetectors and can be used to design multielement photodetectors for various purposes. Assembly of the photosensitive module on raster consists in the fact that sticking cryogenic-resistant glue photosensitive module is carried out using multicontact probe head with symmetric arrangement of 2n (n=1, 2…) of probes (usually made from stainless steel), which are exactly on contact pads of reading LSI chips intended for output signals by welding (usually gold) leads to the raster. Since the thinned press on the photosensitive element is not allowed, and performing pressure over the entire periphery region insecure, since in this area is the reading LSI circuit, which can be damage, the load should be performed on the most protected against damage area, which are contact pads intended for testing of reading LSI chips and welding leads on the raster. In a typical amount of contact pads (~30 pcs.) on the reading LSI chips sticking cryogenic-resistant glue photosensitive module containing thinned photosensitive element, on the raster is carried out using standard contact device with fixed arrangement of probes (typically tungsten), intended for control of reading LSI chips, which enables uniform load on the photosensitive module with a value required to reduce the adhesive layer to thickness of 3-5 mcm, providing strong connection of cryogenic-resistant glue at cooling up to working temperature of liquid nitrogen.

EFFECT: invention enables flawlessly performing assembly of photosensitive module on raster during gluing cryogenic-resistant adhesive.

2 cl, 4 dwg