FIELD: microelectronics; measurements and inspections of integrated circuits and semiconductor devices. SUBSTANCE: device has substrate 4, frame 3 with chip carrying inspected integrated circuit 1 placed in center of its hole, conductors 6 with measuring contact pads 7 placed on external surface of insulating film 8 above face surface of integrated circuit 1 whose contact pads are fixed through contact holes 10 in insulating film 8 to conductors 6 carrying measuring contact pads 7; rear side of chip and frame 3 are fixed on substrate 4 through current-conducting layer made of euthenic alloy, such as aluminium-germanium alloy. EFFECT: reduced contact resistance and improved reliability and validity of inspection results; improved efficiency of heat transfer operating under heat-load conditions. 3 cl, 2 dwg
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Authors
Dates
1997-06-27—Published
1993-01-25—Filed