FIELD: semiconductor microelectronics.
SUBSTANCE: invention relates to technology of controlling functional and dynamic parameters of multi-output LIC chips. Technical result is achieved by applying a layer of material over the whole surface of the zone of bending of each probe, which increases strength of the bending zone of the probe. To work only at room temperature it is enough to cover this place with a drop of glue, for example, based on epoxy resin. For operation at nitrogen temperatures, the probes can be hardened by forcing the surface of the zone of bending with solder, for example silver-based hard solder.
EFFECT: object of the invention consists in increasing strength of probes of GTP.
3 cl, 3 dwg
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