INTEGRATED CIRCUIT Russian patent published in 1999 - IPC

FIELD: computer and radio-electronic hardware. SUBSTANCE: introduced in semiconductor chip of integrated circuit are switching rings arranged over chip perimeter, their number being equal to number of chip leads. Apart from available contact pads referred to in this case as internal ones there are also external pads arranged at edge of semiconductor chip. All contact pads are elongated to ensure connection of any desired lead of integrated circuit package to any desired internal contact pad of chip; this ability is implemented on condition that desired internal contact pads are electrically connected to external ones by means of switching rings. EFFECT: improved reliability and facilitated manufacture of printed-circuit board incorporating integrated circuits. 5 dwg