METHOD FOR AUTOMATED INSTALLATION OF BALLS ON BGA OR CSP MICROCHIPS DURING REBALLING Russian patent published in 2022 - IPC H05K13/06 H05K3/30 H01L23/50 

FIELD: radio engineering.

SUBSTANCE: invention relates to radio electronics and can be used for automated installation of new balls of a microchip during reballing. The technical result is ensured by the fact that, in the method for installation of balls when reballing microchips in BGA and CSP bodies, new balls are placed in an apparatus, on the rigid base whereof a ceramic substrate is installed with holes arranged in a matrix, wherein the diameter of the holes matches the diameter of the balls and the thickness of the substrate is 0.6 to 0.7 of the diameter of the balls. The base and the substrate are therein fastened together by a frame installed on top of the substrate with sides and a chute for removing extra balls. The apparatus with the balls is secured on the object table of the automatic SMT component installation apparatus, the microchip with a flux gel applied to the surface thereof is secured in a tool set with a base and two walls, the distance between which is adjusted by means of a screw, and secured on the conveyor line of the automatic SMT component installation apparatus. Each ball is therein installed on contact pads of the microchip in the automatic mode by means of a tool of the automatic SMT component installation apparatus, followed for directing the microchip with the new balls installed for reflow soldering.

EFFECT: increase in the efficiency of use of the surface-mount equipment due to the provided possibility of installing balls on any microchip or on multiple microchips simultaneously without aids and stencils for each type of microchip, automation of the process, reduction in the proportion of manual labour.

1 cl, 6 dwg