METHOD FOR FIXING ELECTRONIC MODULES IN THE PROCESS OF DEVELOPING PROTOTYPES OF ELECTRONIC APPARATUS Russian patent published in 2022 - IPC H05K3/00 H05K13/04 

FIELD: electrical engineering.

SUBSTANCE: invention relates to educational simulation manuals and can be used to study the fundamentals of electronics, robotics, circuit engineering, and electrical engineering. The technical result is achieved by the fact that in the method for fixing electronic modules in the process of developing prototypes of electronic apparatus, a pallet is made, containing a lower layer made of a dielectric material, a middle layer made of a ferromagnetic material, an upper layer made of a perforated dielectric material with a thickness identical to the thickness of the mounting pads secured on the modules. The perforation is therein made with round holes with the centres form a square-cell grid. Each module is equipped with round mounting pads with diameters identical to the diameters of the perforation holes, proportional to the module and containing a blind hole in the centre of the pad, wherein a magnet is secured with the edge aligned with the edge of the hole. The module is therein attached to the mounting pad by means of a thermoplastic polymer on the side opposite to the magnet, providing free access to the connectors of the module. The module with the mounting pad is then secured on the pallet.

EFFECT: possibility of quick mutual fixation of modules produced by various manufacturers in an arbitrary order.

1 cl, 9 dwg