METHOD OF MAKING ELECTRONIC NODE Russian patent published in 2016 - IPC H05K3/46 H01L21/58 

FIELD: instrument making.

SUBSTANCE: invention relates to instrument making, specifically to technology for production of high-power multichip modules, microassemblies and modules with internal mounting components. Proposed method comprises electronic unit instead of structural components is unpacked chips, as base is plate of monocrystalline silicon. Forming in it through openings with linear sizes corresponding to linear size of frameless chips installed therein. Fixing on one side of base an adhesive tape with an adhesive side to base surface. Fitting through openings with chips with front side adhesive side of adhesive tape. Sealing with polyimide varnish. Holes are then formed in layer of polyimide varnish so as to open contact pads of chip. To form switching layer topology is used and vacuum plasma deposition through a metal mask with a thin removable formed thereon or topology using photolithography processes after vacuum-plasma metal deposition.

EFFECT: technical result is reduced weight and dimensions, reduced complexity and improved reliability of electronic components.

1 cl, 1 dwg