FIELD: chemistry.
SUBSTANCE: invention relates to the etching of copper and its alloys. Options of a solution for etching copper and its alloys are proposed. The solution for etching copper and its alloys, according to the first option, includes components in following amounts, g: 2-aqueous dichloride copper 42.9, ammonium chloride 35, gelatin 0.5, distilled water 140 ml. The solution for etching copper and its alloys, according to the second option, includes components in following amounts, g: 2-aqueous dichloride copper 42.9, sodium chloride 15.1, gelatin 0.5, distilled water 140 ml.
EFFECT: increase in the etching factor to values exceeding the average value of 2-2.5 achieved for most alkaline copper etchants, as well as ensuring the regeneration of the etching composition by the reagent method.
2 cl
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Authors
Dates
2022-05-31—Published
2021-12-07—Filed