FIELD: electronic industry.
SUBSTANCE: invention relates to a composition of fiberglass for the bases of printed circuit boards for the electronic industry, as well as fiberglass and electronic fabric made from it. The proposed composition contains the following components, wt. %: 51.0-57.5 SiO2, 11.0-17.0 Al2O3, more than 4.5 and less than or equal to 6.4 B2O3, 19.5-24.8 CaO, 0.1-1.0 MgO, 0.05-1.2 R2O=Na2O+K2O+Li2O, 0.05-0.8 Fe2O3, 0.01-1.0 TiO2 and 0.01-1.0 F2; at the same time, the range of the ratio of weight percentages C1=SiO2/B2O3 is from 8.1 to 12.7, the range of the ratio of weight percentages C2=B2O3/(R2O+MgO) is from 2.05 to 6.3 and the total weight percentage of the components listed above is greater than or equal to 99%. The proposed composition can reduce the cost and evaporation of raw materials. It can also improve the dielectric properties of glass, enhance the mechanical properties and water resistance of glass fiber, and improve the temperature range for fiber formation.
EFFECT: proposed composition is suitable for large-scale production in bath furnaces.
20 cl, 5 tbl, 9 ex
Title |
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