FIELD: metal processing.
SUBSTANCE: invention relates to a method for producing a solder product and a copper product from the first metal composition based on lead-tin, which contains at least, wt. %: 40 copper and at least 5.0 tin and lead together. The method includes the stages of partial oxidation of the first liquid bath containing the first lead-tin metal composition, with the formation of the first diluted copper metal composition and the first solder refining slag, followed by the separation of the slag from the metal composition, and the stage of partial oxidation of the second liquid bath containing the first diluted copper metal composition, with the formation of the first metal composition with a high copper content and the third solder refining slag, followed by the separation of the third solder refining slag from the first metal composition with a high copper content to obtain a solder product from the first solder refining slag.
EFFECT: invention provides an increase in the degree of copper extraction and the degree of purity of the products obtained and a reduction in the amount of equipment.
18 cl, 24 tbl, 2 ex
Title | Year | Author | Number |
---|---|---|---|
IMPROVEMENT OF PRODUCTION OF COPPER/TIN/LEAD | 2018 |
|
RU2772863C2 |
IMPROVED METHOD FOR SOLDER PRODUCTION | 2018 |
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RU2784865C2 |
METHOD FOR PRODUCING RAW SOLDERING PRODUCT AND COPPER PRODUCT | 2018 |
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IMPROVED METHOD FOR PRODUCTION OF HIGH-PURE LEAD | 2020 |
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RU2786016C1 |
IMPROVED COMBINED PRODUCTION OF LEAD AND TIN PRODUCTS | 2020 |
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RU2784362C1 |
ADVANCED PRODUCTION OF TIN INCLUDING A COMPOSITION CONTAINING TIN, LEAD, SILVER, AND ANTIMONY | 2020 |
|
RU2780328C1 |
IMPROVED SOLDER AND METHOD FOR PRODUCING HIGH-PURITY LEAD | 2017 |
|
RU2753365C2 |
COPPER ELECTROREFINING IMPROVEMENT | 2019 |
|
RU2790423C2 |
Authors
Dates
2022-08-22—Published
2018-12-11—Filed