FIELD: heat engineering.
SUBSTANCE: invention relates to heat engineering and can be used in electronic equipment cooling systems. In the method of cooling electronic equipment using combined flows of gas and microdroplets, based on the movement of a thin film of liquid due to the gas flow in the channel, the areas of the electronic component are irrigated with flows of liquid microdroplets using a sprayer located on one of the channel surfaces, and the expiration of liquid microdroplets is carried out under an angle of 10 to 90 degrees in the direction of the flow of gas or working fluid in the channel, which is measured from the axis of the direction of the gas flow, while the sprayer is a nozzle or a line of nozzles.
EFFECT: increasing the cooling efficiency of electronic components highly stressed by heat fluxes.
1 cl, 1 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| TWO-PHASE, HYBRID, SINGLE-COMPONENT ELECTRONIC EQUIPMENT COOLING SYSTEM | 2020 |
|
RU2760884C1 |
| COOLING SYSTEM OF ELECTRONIC EQUIPMENT USING GAS FLOW AND COMBINED FILM AND DROP FLOWS OF LIQUID | 2023 |
|
RU2822416C1 |
| METHOD OF COOLING ELECTRONIC EQUIPMENT WITH FILM AND DROPLET FLOWS OF LIQUID USING FINNING | 2018 |
|
RU2706325C1 |
| METHOD OF ELECTRONIC EQUIPMENT COOLING USING COMBINED FILM AND DROP LIQUID FLOWS | 2016 |
|
RU2649170C1 |
| EVAPORATIVE-CONDENSING GAS-LIQUID COOLING SYSTEM FOR ELECTRONIC EQUIPMENT | 2021 |
|
RU2781758C1 |
| METHOD OF COOLING ELECTRONIC EQUIPMENT USING COMBINED FILM AND GAS-DROPLET FLOWS | 2019 |
|
RU2732624C1 |
| SYSTEM FOR COOLING ELECTRONIC EQUIPMENT WITH MIXTURE OF STEAM AND NON-CONDENSED GAS | 2023 |
|
RU2816279C1 |
| METHOD FOR COOLING ELECTRONIC EQUIPMENT | 2020 |
|
RU2755608C1 |
| DEVICE FOR INTENSIFYING HEAT EXCHANGE BY MEANS OF MICRO FRACTURES IN LIQUID FILM | 2023 |
|
RU2820933C1 |
| DEVICE FOR INTENSIFYING HEAT EXCHANGE IN LIQUID FILM ENTRAINED BY GAS FLOW BY MEANS OF MICRO-CAVERNS | 2023 |
|
RU2821687C1 |
