FIELD: instrument making.
SUBSTANCE: invention relates to the thermoelectric devices and can be used in the thermoelectric coolers (TEC) manufacturing. Forming the first conductive layer containing the conducting paths on the first ceramic plate. Soldering the thermoelectric material branches onto the first conductive layer conducting paths. Forming the second conductive layer containing conducting paths on the temporary board. Soldering the second conductive layer conducting paths to the thermoelectric material branches. Applying the protective coating onto the thermoelectric material branches and soldered joints. Removing the temporary board by etching. Applying the elastic heat-conducting adhesive layer onto the second ceramic plate. Gluing the second ceramic board to the second conductive layer conducting paths. Temporary board can be removed mechanically.
EFFECT: conductive layer manufacturing and its positioning on the thermoelectric material branches simplification and increase in the TEC thermal cyclic stability.
4 cl, 1 tbl, 7 dwg
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Authors
Dates
2019-02-25—Published
2018-03-21—Filed