MULTICHIP MODULE (MCM) ASSEMBLY Russian patent published in 2023 - IPC B41J2/155 

Abstract RU 2787543 C2

FIELD: printing.

SUBSTANCE: multichip module (hereinafter – MCM) assembly is disclosed, containing graphite substrate having a front surface and a rear surface, as well as containing a set of silicon chips installed on the front surface, a printed wiring board attached to graphite substrate and provided with holes surrounding outer profiles of silicon chips. In this case, graphite substrate contains one or more channels for paint on the rear surface and one or more grooves for paint supply, passing through graphite substrate and being in liquid communication with corresponding one or more channels for paint, so that paints of different types can be supplied to each of silicon chips. MCM assembly additionally contains a graphite overlay plate made with the possibility of covering of one or more channels for paint of graphite substrate.

EFFECT: creation of a simpler and reliable, safe, and easy-to-produce module due to elimination of complex operations and the need for use of molded parts.

9 cl, 9 dwg

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RU 2 787 543 C2

Authors

Tori, Silvano

Sarti, Marco

Cappello, Paolo

Dates

2023-01-10Published

2019-07-15Filed