FIELD: printing.
SUBSTANCE: multichip module (hereinafter – MCM) assembly is disclosed, containing graphite substrate containing a set of silicon chips directly attached to graphite substrate and a printed wiring board (PWB) attached to graphite substrate by means of solvent-resistant adhesive and provided with holes surrounding outer profiles of silicon chips. A printing bar is also disclosed, containing a set of MCM assemblies.
EFFECT: obtainment of MCM assembly.
15 cl, 14 dwg
Authors
Dates
2023-01-23—Published
2019-07-18—Filed