MULTICHIP MODULE (MCM) ASSEMBLY AND PRINTING BAR Russian patent published in 2023 - IPC B41J2/14

Abstract RU 2788596 C2

FIELD: printing.

SUBSTANCE: multichip module (hereinafter – MCM) assembly is disclosed, containing graphite substrate containing a set of silicon chips directly attached to graphite substrate and a printed wiring board (PWB) attached to graphite substrate by means of solvent-resistant adhesive and provided with holes surrounding outer profiles of silicon chips. A printing bar is also disclosed, containing a set of MCM assemblies.

EFFECT: obtainment of MCM assembly.

15 cl, 14 dwg

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RU 2 788 596 C2

Authors

Tori, Silvano

Sandri, Tazio

Sarti, Marco

Giovanola, Lucia

Dates

2023-01-23—Published

2019-07-18—Filed