FOAMED PHENOLIC RESIN LAMINATED BOARD Russian patent published in 2023 - IPC B32B27/42 B32B5/18 B32B5/24 B29K61/04 C08J9/14 

FIELD: cold and heat insulating materials.

SUBSTANCE: cold and heat insulating materials for construction materials and industrial enterprises and relates to a laminated board made of foamed polymer resin. A foamed phenolic resin laminated board in which a flexible surface material is located on at least the top and bottom surfaces of the foamed phenolic resin. Foamed phenolic resin contains HCFO-1224yd(Z) ((Z)-1-chloro-2,3,3,3-tetrafluoropropene), has a density of not less than 20 kg/m³ and not more than 55 kg/m³, the ratio of closed mesh is 80% or more, the average cell diameter is from 60 µm to 200 µm, the seepage area ratio of the surface material is 30% or less, and the content of HCFO-1224yd(Z) in the volume of 22.4× 10-3 m³ foamed phenolic resin is from 0.06 mol to 0.35 mol.

EFFECT: obtaining a foamed phenolic resin laminated board with good appearance, in which seepage from the surface material is suppressed while reducing thermal conductivity due to the use of HCFO-1224yd(Z).

6 cl, 1 dwg, 16 ex, 1 tbl