LAMINATED BOARD AND COMPOSITE BOARD FROM FOAMED PHENOLIC RESIN Russian patent published in 2023 - IPC B32B27/42 B29K61/04 B32B5/18 B32B5/24 C08J9/14 B29C44/28 

FIELD: heat-insulating composite materials.

SUBSTANCE: invention relates to a laminated board made of foamed phenolic resin. In the board, the surface material is located on at least one side of the foamed phenolic resin and on the back side of one side. The foamed phenolic resin has a density of not less than 22 kg/m³ and not more than 50 kg/m³, a cell diameter of not less than 50 mcm and not more than 170 mcm, and a percentage of closed cells of not less than 80%. When HCFO-1224yd (Z) ((Z)-1-chloro-2,3,3,3-tetrafluoropropene), aliphatic hydrocarbons with carbons of 6 or less, chlorinated saturated hydrocarbons with carbons of 5 or less and hydrofluoroolefins are gas components, the foamed phenolic resin only contains HCFO-1224yd(Z) as the gas component. The internal pressure of the air bubble in the cell is 0.20 atm or more.

EFFECT: obtaining a laminated board from a foamed phenolic resin, which has thermal conductivity and, at the same time, sufficient surface smoothness.

11 cl, 1 dwg, 3 tbl, 13 ex