FIELD: manufacturing technology.
SUBSTANCE: invention relates to the manufacture of electronic equipment using multilayer printed circuit boards (MPCB). Technical result is achieved by the fact that in the claimed design, an additional heat sink is formed in the topological pattern of a printed circuit board from electrically unused copper, which is part of the conductive layers. Heat sink is a thermal platform, interconnected by metallized through holes located one under the other under the body of the fuel ERI, or a mating structural element throughout its area, starting with the installation layer of the printed circuit board and further on all layers, or on a group of adjacent layers, without restrictions on the number of layers of the printed circuit board, the type of case and the method of installation of fuel-generating ERI.
EFFECT: improving the efficiency of heat removal from the fuel ERI on the printed circuit board and the structural elements of the printed circuit board.
1 cl, 1 dwg
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