PLASMA CHAMBER FOR ACTIVATION OF SURFACE OF MICROFLUIDIC CHIPS AND THEIR SUBSEQUENT SEALING Russian patent published in 2024 - IPC H05H1/24 C23C16/44 H01J37/32 

FIELD: various technological processes.

SUBSTANCE: invention relates to plasma treatment of surfaces, in particular the surface of microfluidic chips for activation and sealing. Plasma chamber for activating the surface of microfluidic chips and their subsequent sealing comprises a vacuum chamber, in which at least one wall is made of dielectric material, two electrodes — upper and lower, evaporator with liquid, table and sample. Evaporator, lower electrode and table are located inside vacuum chamber, and upper electrode is located outside vacuum chamber. At that, the lower electrode is located on the table so that a gas gap is formed between it and the wall of the vacuum chamber from dielectric material, sample is placed directly on the lower electrode in the gas gap. Evaporator is located outside the gas gap, where the dielectric barrier discharge is ignited, so that when the liquid boils, its drops do not fall on the surface of the lower electrode or sample.

EFFECT: simplification of design and reduction of parameters to be controlled during operation, while maintaining the possibility of controlling parameters of plasma combustion in the chamber.

7 cl, 4 dwg