METHOD OF SURFACE MOUNTING OF ELECTRONIC EQUIPMENT OF RADIOELECTRONIC EQUIPMENT Russian patent published in 2019 - IPC H05K3/34 

FIELD: machine building.

SUBSTANCE: invention relates to radio electronic engineering and can be used in production of various radioelectronic equipment and radio-electronic devices of critical and household use, including radio-electronic equipment of spacecrafts, which operates under the effect of space conditions, with long periods of active existence. Result is achieved by the fact that surface mounting of electronic equipment of radioelectronic equipment is carried out simultaneously for a group of electrical and radio products, wherein preparatory operations are carried out first on one side of printed circuit board, and then on second side of printed circuit board, after completion of preparatory operations on both sides of printed circuit board soldering of electric radio devices simultaneously on two sides of printed-circuit board is performed in accordance with required temperature profile of solder paste fusion. Conducting group soldering simultaneously on both sides of the printed circuit board in one step enables to significantly reduce labour intensity and complexity of the mounting method, increased reliability and service life of printed circuit boards due to reduction of number of temperature cycles of soldering and time of high-temperature heating.

EFFECT: technical result is reduced complexity and labour intensity during manufacturing, increased reliability and resource of printed-circuit boards manufactured using the proposed method.

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